Thin Film System TFS 500 ALD reactor is designed for thin film processing, protective coating, functional surface buildup and doping purposes. Substrate alternatives include wafers and other planar substrates, powders and porous substrates and complex 3D substrates. TFS 500 can be equipped with a manual load lock for rapid wafer processing. Reactor operates in batch mode. Variable reaction chambers can be fitted to the reactor making it possible to optimize the reaction chamber design depending on the application.

TFS 500 Atomic Layer Deposition System brochure in PDF-format
TFS 500 Atomic Layer Deposition System presentation in PDF-format